A photo-sensing device package and the method of packaging such device is provided.
The package includes an assembly portion having a substrate formed of a material
substantially transparent to light within a predetermined range of wavelengths
and a sensing portion having at least one photo-sensing die photo-electronically
transducing light within the predetermined range of wavelengths. The assembly portion
is formed with at least one metal layer disposed on the substrate about a front
surface region thereof, and at least one passivation layer formed to extend over
the metal layer. The passivation layer is patterned to define a plurality of first
and second access openings respectively about a plurality of first solder wettable
pads and at least one second solder wettable pad on the metal layer. Each of the
first solder wettable pads is joined by a first solder joint to a solder bump pad
formed on the sensing portion, while the second solder wettable pad is joined by
a second solder joint to external circuitry.