A package type semiconductor device comprising: a semiconductor chip having a
semiconductor
part; a main electrode for connecting to a first region of the semiconductor part;
a control wiring layer for connecting to a second region of the semiconductor part;
a blocking member electrically isolated from the control wiring layer; a first
metallic layer; a protection film disposed among the main electrode, the control
wiring layer and the blocking member; and a metal block for connecting to the main
electrode through the first metallic layer. The chip, the main electrode, the control
wiring layer, the blocking member, and the metal block are packaged. The blocking
member is disposed between the main electrode and the control wiring layer.