An apparatus and a method for testing semiconductor devices such as integrated circuits having a handler for picking up an integrated circuit to be tested and placing the picked up integrated circuit into an automatic circuit test apparatus. When the circuit to be tested is inserted into the test apparatus an extraneous signal shield is automatically engaged to enclose the device being tested and protect the circuit, being tested, from stray extraneous electromagnetic signals during the test thereby preventing said stray electromagnetic interference from inducing errors in the tested circuit.

 
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< Windowed package having embedded frame

< Molded package for micromechanical devices and method of fabrication

> Multiple-chip probe and universal tester contact assemblage

> Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof

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