A drop emitting apparatus including a diaphragm layer disposed on a fluid channel layer, a roughened bonding region formed on a surface of the diaphragm layer, a thin film circuit having conformal raised contact regions disposed on the bonding region, and a plurality of electromechanical transducers adhesively attached to the raised contact regions and electrically connected to the conformal raised contact regions by asperity contacts formed between the conformal raised contact regions and the electromechanical transducers.

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