In an electric characteristic testing process corresponding to a process of the semiconductor apparatus manufacturing processes, in order to test a large area of the electrode pad of the body to be tested in a lump, an electric characteristic testing is performed by pressing a testing structure provided with electrically independent projections having a number equal to a number of conductor portions to be tested formed on an area to be tested of a body to be tested to the body to be tested.

 
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> Arrangement of wiring lines including power source lines and channel wirings of a semiconductor integrated circuit having plural cells

> Quad flat non-leaded package comprising a semiconductor device
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