A film having a recess provided in a surface of the film is provided. The recess included a first portion and a second portion connected with the first portion. The second portion is deeper than the first portion. The recess in the film is filled with a conductive paste so as to fill the first portion and the second portion of the recess with a first portion and a second portion of the conductive paste, respectively. Then, the surface of the film is attached onto a surface of a substrate. The conductive paste is transferred to the surface of the substrate by removing the film from the substrate so as to transfer the first portion and the second portion of the conductive paste to the surface of the substrate. The transferred first portion and the transferred second portion of the conductive paste are baked to provide a first portion and the second portion of a conductor pattern, respectively. An insulating layer is provided on the conductor pattern. Then, the substrate, the insulating layer, and the conductor pattern are cut along a first border extending across the second portion of the conductor pattern, thus providing an electronic device. In this method, the side electrode is formed simultaneously to the cutting of the substrate.