A heat sink fan of the present invention includes a heat sink and an axial flow fan, and the axial flow fan includes a motor, an impeller and a housing. An outer wall surface of a cylindrical portion of the housing is formed with an arm which engages with the heat sink and fixes the housing and the heat sink. The arm is provided with a lead wire retaining hook. A interspace is formed between the lead wire retaining hook and the arm, and the lead wire is detachably held in the interspace. The packing or transportation operation is enhanced, and convenience of mounting operation of the lead wire to electronic equipment is enhanced.

 
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> Heat dissipating device for an integrated circuit chip

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