In one aspect, there is described a thin film or wafer encapsulated electromechanical device. In one embodiment of this aspect of the invention, the electromechanical device comprises a substrate, a mechanical structure disposed over the substrate wherein an anti-stiction layer is disposed on at least a portion of the mechanical structure, a wafer bonded encapsulation structure, disposed over the mechanical structure, to seal a chamber, an anti-stiction channel, etched into the substrate, to provide access to at least a portion of the mechanical structure disposed in the chamber, and an anti-stiction plug, disposed over or in the anti-stiction channel, to re-seal the chamber.