A method for fabricating an in-plane switching LCD device includes forming a data line and a light-shielding layer on a substrate, forming a pixel electrode line and an active region with a polycrystalline silicon thin film, forming a first insulating layer on the substrate, forming a gate electrode and a common electrode line on the first insulating layer, forming a second insulating layer on the substrate, forming a first contact hole that exposes at least portions of the data line and the active region, and forming a connection electrode that connects at least portions of the exposed data line and the active region.

 
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> Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems

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