Disclosed are a reflection type LCD and method of manufacturing the same. A wiring layer having a first and second metal layer (102, 104) is formed on a substrate (100) including a display region (D) and a pad region (P). Upon the substrate (100) and the wiring layer is formed a first passivation layer (155), and contacts with a wiring terminal (115) and the first metal layer (102). A second passivation layer (180) is formed on the substrate except the pad region (P). The pad contact hole (160) extends to a position under the second passivation layer (180). The second passivation layer (180) covers a region in the pad contact hole (160) where the step coverage of the pad electrode (170) is poor, thereby preventing a battery effect.

 
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> Chemical mechanical polishing process for manufacturing semiconductor devices

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