A semiconductor device assembly and method of making the devices are
disclosed. The assembly comprises a semiconductor die attached to an
electrically conductive layer, which is, in turn, connected to a
dielectric layer carrying conductive traces of the electrical connection
layer. The conductive traces provide connection between an array of
discrete conductive elements and bonding wires connected to bond pads of
the die. The conductive layer enhances thermal conduction and structural
stiffness for the assembly. In addition, the conductive layer provides a
voltage reference plane that may be connected to a power source, a ground
source, or an intermediate reference voltage. The conductive layer also
includes at least one electrical current isolation slot, which segments
the conductive layer to help isolate noise induced in one segment of the
conductive layer from the other segments.