An electronic component inspection apparatus includes an inspection socket which inspects a component, a tray disposition area in which a component waits before it is inspected, tray disposition areas which store a component after it has been inspected, components transfer mechanisms each of which has a vacuum or suction nozzle that can pick up and hold a component to transfer the component, a component position confirmation camera which can capture an image of the component that is being transferred, and a controller which transfers a component to the inspection socket, via a position in which the component position confirmation camera captures an image of the component being held by the suction nozzle while the component is being transferred from the tray disposition area to the inspection socket, and based on that captured image, controls the drive of the components transfer mechanisms so that the component is set in the inspection socket.