A surface acoustic wave device is provides and comprises a flexible substrate having a first side and a piezoelectric film attached to at least a portion of the first side of the flexible substrate. The piezoelectric film can have a first side and a second side. A surface acoustic wave circuit can adjoin at least a portion of the first side of the piezoelectric film. These devices can comprise thin and flexible substrates, such as polyimide to make the devices flexible. If adhesive is applied to the back of devices constructed in accordance with the invention, such devices can be adhered to almost any surface, even a curved surface. The devices of the present invention can be easily integrated with other devices.