A method of manufacturing a thermoelectric module is provided. The method includes mounting a thermoelectric material to a substrate such that a portion of the thermoelectric material covers a removable pattern. The thermoelectric material is then segmented and the removable pattern is removed. The portions of the thermoelectric material which were covering the removable pattern are also removed, leaving the portions of the thermoelectric material not covering the removable pattern attached to the substrate.

 
Web www.patentalert.com

< Manufacturing method of semiconductor device

> Imager with image-taking portions optimized to detect separated wavelength components

> Method for etching a tapered bore in a silicon substrate, and a semiconductor wafer comprising the substrate

~ 00518