A wiring structure of a semiconductor device may have an insulation layer, a spacer and a plug. The insulation layer may be provided on a substrate and may have an opening through which a contact region of the substrate is exposed. The spacer may be provided on a sidewall of the opening. The plug may fill the opening and may include a polysilicon pattern doped with impurities, a metal silicide pattern, and a metal pattern sequentially provided on the substrate.

 
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< Die-up integrated circuit package with grounded stiffener

> Semiconductor device assemblies and packages including multiple semiconductor device components

> Alignment key structure in a semiconductor device and method of forming the same

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