A digital camera module (100) includes a chip package (110) and a lens module (130), mounted on the chip package, for forming a focused image on the chip package. The chip package includes a supporter (112), a chip (114), a plurality of wires (116), a main adhesive (118), and a cover plate (119). The supporter includes a through hole defined therethrough and has a plurality of top contacts (1130) formed thereon around the through hole. The chip is disposed in the through hole and includes a plurality of pads (1144) arranged thereon. The wires electrically connect the pads to the top contacts. The main adhesive is applied to a gap between the chip and the supporter and fixes the chip to the supporter. The cover plate is adhered and supported on the main adhesive. A method for making the chip package is also provided.