In one embodiment, a semiconductor package is formed to include a tamper barrier that is positioned between at least a portion of the connection terminals of the semiconductor package and an edge of the semiconductor package.

 
Web www.patentalert.com

< Semiconductor device, display module, and manufacturing method of semiconductor device

> Chip package, method of making same and digital camera module using the package

> Stacked packaging designs offering inherent anti-tamper protection

~ 00570