Silicon compounds having fluorinated hemiacetal structure are provided. Silicone resins having the same structure have an appropriate acidity to enable formation of a finer pattern by minimizing the pattern collapse by swelling, exhibit improved resistance to the etching used in the pattern transfer to an organic film, and are thus suited for use in resist compositions for the bilayer process.

 
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< Positive photosensitive resin composition, method for forming pattern, and electronic part

> Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition

> Positive resist compositions and patterning process

~ 00570