A mobile, transportable, unipolar electrostatic chuck for clamping thin
wafers is described, which avoids unintentional discharging of the
package of Mobile Chuck and wafer during wet processing. Short circuits
between the contact holes of the chuck and the clamped wafer can lead to
the loss of clamping force. A pn-junction within the semiconductor
substrate material electrode of the chuck is disclosed, which is using a
diode effect to avoid the loss of charges. Dielectric protection layers
of PTFE, Y.sub.2O.sub.3 or ferroelectric materials can be used to cover
the open contacts of the chuck. This enables the application of Mobile
Chucks also for wet etch-, photo- and cleaning processes. Mobile Chucks
are made of semiconductor material and semiconductor manufacturing
processes are applied. Those Mobile Chucks have nearly identical
properties as the clamping substrate itself. This reduces the risk of
cross-contamination, particle generation and the risk of mechanical
stress due to different coefficients of thermal expansion.