The present invention provides a solution for interleaving data frames, in
a semiconductor device manufacturing system in which the processing
apparatus for conducting a process on any one of a semiconductor
substrate and a thin film on a surface thereof; a self-diagnostic system
for diagnosing a state of the processing apparatus; and a parameter
fitting apparatus for maintaining a parameter of the self-diagnostic
system when an inspection result of the semiconductor substrate having
undergone the process has been determined to be correct, and for changing
the parameter of the self-diagnostic system when the inspection result
has been determined to be incorrect.