A microstructure includes a first structural layer and a second structural layer which faces the first structural layer with a space interposed therebetween and is partially fixed to the first structural layer. At least one of the first structural layer and the second structural layer can be displaced. Further, opposed surfaces of the first structural layer and the second structural layer are different in roughness.

 
Web www.patentalert.com

< Latchup robust array I/O using through wafer via

< Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame

> Method for integrating trench MOS Schottky barrier devices into integrated circuits and related semiconductor devices

> Semiconductor integrated circuit including metal mesh structure

~ 00616