Component assemblies and methods of making component assemblies are disclosed. An exemplary component assembly may generally include a capsule defining a cavity for receiving a component. The component assembly may additionally include at least one lead extending from the component and through the capsule to allow communication between the component and a network or device. The lead may generally define a sealed length within the capsule that is at least as great as a predetermined or expected intrusion distance of an external contaminant along the sealed length over an expected lifetime or service interval associated with the component encapsulated in the cavity.