Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby

   
   

A crystalline substrate based device includes a crystalline substrate having formed thereon a microstructure, and a transparent packaging layer which is sealed over the microstructure by an adhesive and defines therewith at least one gap between the crystalline substrate and the packaging layer. The microstructure receives light via the transparent packaging layer.

Un dispositif basé par substrat cristallin inclut un substrat cristallin ayant formé là-dessus une microstructure, et une couche d'empaquetage transparente qui est scellée au-dessus de la microstructure par un adhésif et définit en conséquence au moins un espace entre le substrat cristallin et la couche d'empaquetage. La microstructure reçoit la lumière par l'intermédiaire de la couche d'empaquetage transparente.

 
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