Electrical connection between two faces of a substrate and manufacturing process

   
   

Electrical connection between two faces of a substrate and manufacturing process. The connection is made by a part (46) of a conducting or semi conducting substrate (20) completely surrounded by at least one electrically insulating trench (32, 36, 44). A contact pad (42) is located on the back face (40) and conducting tracks (38) are located on the front face. The connection is made through the substrate itself. Application to the manufacture of circuits, components, sensors, etc.

Электрическое соединение между 2 сторонами субстрата и процесса производства. Связьо налажено частью (46) дирижируя или semi дирижируя субстрата (20) вполне окруженного по крайней мере одним электрически изолируя шанцом (32, 36, 44). Пусковая площадка контакта (42) расположена на задней стороне (40) и дирижируя следы (38) расположены на передней стороне. Связьо налажено до субстрат сам. Применение к изготовлению цепей, компонентов, датчиков, etc.

 
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