III-V compound semiconductor

   
   

Provided is a III-V compound semiconductor having a layer formed from a first III-V compound semiconductor expressed by the general formula In.sub.u Ga.sub.v Al.sub.w N (where 0.ltoreq.u.ltoreq.1, 0.ltoreq.v.ltoreq.1, 0.ltoreq.w.ltoreq.1, u+v+w=1), a pattern formed on the layer from a material different not only from the first III-V compound semiconductor but also from a second III-V compound semiconductor hereinafter described, and a layer formed on the first III-V compound semiconductor and the pattern from the second III-V compound semiconductor expressed by the general formula In.sub.x Ga.sub.y Al.sub.z N (where 0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1, 0.ltoreq.x.ltoreq.1, x+y+z=1), wherein the full width at half maximum of the (0004) reflection X-ray rocking curve of the second III-V compound semiconductor is 700 seconds or less regardless of the direction of X-ray incidence. In the III-V compound semiconductor, which is a high quality semiconductor, the occurrence of low angle grain boundaries is suppressed.

 
Web www.patentalert.com

< Production method of III nitride compound semiconductor, and III nitride compound semiconductor element based on it

< LSI device polishing composition and method for producing LSI device

> Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same

> Semiconductor device and method of relaxing thermal stress

~ 00156