A multi-chip stack structure and method of fabrication are provided
utilizing self-aligning electrical contact arrays. Two or more arrays of
interconnection contacts are provided, with one array being a rough
aligned contact array, and a second array being a high bandwidth contact
array. The rough aligned contact array has larger contacts and at least a
portion thereof which melts at a substantially lower temperature than the
melting temperature of the contacts of the high bandwidth contact array.
By positioning two integrated circuit chips in opposing relation with the
arrays mechanically aligned therebetween, and applying heat to melt the
contacts of the rough aligned array, the two chips will rotate to align
the respective contacts of the high bandwidth contact arrays, thereby
achieving improved connection reliability between the structures.
