The invention relates to a microstructure cooler 3 for an article 4 to be
cooled, whereby the cooler 3 includes a stack of at least two metal films
1 and one base plate 5 that can be brought via a thermal contact surface 6
into thermal contact with the article 4, the metal films 1 and the base
plate 5 are joined to one another in a material fit, present in the metal
films 1 are channels 2 for cooling medium, and the channels 2 have a width
in the range of 100 to 2,000 .mu.m, a depth in the range of 25 to 1,000
.mu.m, and a mean interval in the range of 50 to 1,000, residual film
thicknesses resulting from the channels 2 in the metal films 1 are in the
range of 50 to 300 .mu.m, and the base plate 5 has a thickness in the
range of 200 to 2,000 .mu.m.
