Metal core integrated circuit package with electrically isolated regions and associated methods

   
   

An integrated circuit chip package having a metal substrate core having two or more electrically isolated regions, wherein the electrically isolated regions of the metal substrate core may be coupled with voltage rails of an integrated circuit chip.

Un paquete de la viruta de circuito integrado que tiene una base del substrato del metal el tener de dos o más regiones eléctricamente aisladas, en donde las regiones eléctricamente aisladas de la base del substrato del metal se pueden juntar con los carriles del voltaje de una viruta de circuito integrado.

 
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