A method for tuning an electro-mechanical device such as a MEMS device is disclosed.
The method comprises operating a MEMS device in a depressurized system and using
FIB micromachining to remove a portion of the MEMS device. Additionally, a method
for tuning a plurality of MEMS devices by depositing an active layer and then removing
a portion of the active layer using FIB micromachining. Also, a method for tuning
a MEMS device and vacuum packaging the MEMS device in situ are provided.
