A semiconductor device having a seal member of insulative resin, tab suspension
leads and leads exposed to the mounting surface of the seal member, a semiconductor
element located in the seal member and fixed by an adhesive of the tab surface,
and conductive wires for electrically connecting electrodes of the semiconductor
element to the leads. At least a lead portion of the leads has an inverted trapezoid-like
section configured of a upper surface embedded in the seal member, a lower surface
exposed from the seal member, and side surfaces connecting the two side edges of
the upper and lower surfaces. Two side edges of the upper surface are formed with
machined surfaces, respectively, having one end connected to the upper surface
and the other end connected to side surfaces. The machined surfaces are formed
by the pressing process in different directions of extension with the upper and
side surfaces.
