The metal layers embedded into the contact holes of various kinds in shape
are used as the lines and are employed as the lines for controlling the
substrate bias. The first-layer metal line layers are made thin so as to
be also employed as the lines for controlling the substrate bias.
Moreover, the second-layer metal line layers are employed as the copper
line layers. Thereby, a semiconductor integrated circuit which allows a
high-speed and low-power operation is provided with a small area and
without increasing the number of the masks.
