Semiconductor wafer having discharge structure to substrate

   
   

To prevent an abnormal discharge phenomenon from occurring due to charge build up on conductive layer region that has a large surface area and that is a region other than the region where a semiconductor device is formed on a semiconductor substrate, the semiconductor substrate structure being made to have an electrical connection between the conductive layer region having a large surface area and the semiconductor substrate.

Para evitar que un fenómeno anormal de la descarga ocurra debido a la acumulación de la carga en la región conductora de la capa que tiene un área superficial grande y que es una región con excepción de la región donde un dispositivo de semiconductor se forma en un substrato del semiconductor, la estructura del substrato del semiconductor que es hecha para tener una conexión eléctrica entre la región conductora de la capa que tiene un área superficial grande y el substrato del semiconductor.

 
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> Micro-scale interconnect device with internal heat spreader and method for fabricating same

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