Method of washing a semiconductor wafer

   
   

A nozzle which ejects cleaning solution is disposed above the wafer to be cleaned. The position of the nozzle is such that the cleaning solution ejected from the nozzle drops onto a point on the wafer which is 1 cm or more on this side of the center of rotation. An angle which the direction of ejection of the cleaning solution makes with the wafer surface is set preferably at 5.degree. to 45.degree..

Сопло выкидывает разрешение чистки размещано над вафлей быть очищенным. Положение сопла такое что разрешение чистки выкинутое от сопла падает на пункт на вафле 1 сантиметр или больше на этой стороне центра вращения. Угол направление отстрела разрешения чистки делает с поверхностью вафли установлен предпочтительн на 5.degree. к 45.degree..

 
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