A semiconductor package comprising a low temperature co-fired ceramic
substrate defining opposed top and bottom surfaces. The substrate
comprises at least two stacked ceramic layers and electrically conductive
patterns which extend between the layers and along the top surface of the
substrate. Mounted to the top surface of the substrate and electrically
connected to the conductive patterns is at least one semiconductor die. A
plurality of leads extend at least partially about the substrate in spaced
relation thereto. Each of the leads defines opposed top and bottom
surfaces, the semiconductor die being electrically connected to at least
one of the leads. A package body at least partially encapsulates the
substrate, the semiconductor die and the leads such that at least a
portion of the bottom surface of each of the leads is exposed in the
package body.
